Mon Jul 19, 2021 4:37 pm
V17.2.2 B4
Nvidia
It appears the VU meters in Fairlight are temperamental in that changing the processing order sometimes results in no level display.
I have changed my order from the default (F-E-D) to (F-D-E) and noticed that no levels were being displayed. Upon checking the other order options, some others also did not display the levels however the one I initially chose started to show the track level again.
There seems to be no rhyme or reason why it sometimes does or does not display a track level.
***************DIAGNOTIC INFO*******************************
HWiNFO64 Version 7.02-4430
MONSTER -------------------------------------------------------------------
[Current Computer]
[Operating System]
Operating System: Microsoft Windows 10 Professional (x64) Build 19043.1110
UEFI Boot: Present
Secure Boot: Present
Central Processor(s) ------------------------------------------------------
[CPU Unit Count]
Number Of Processor Packages (Physical): 1
Number Of Processor Cores: 16
Number Of Logical Processors: 32
AMD Ryzen 9 3950X ---------------------------------------------------------
[General Information]
Processor Name: AMD Ryzen 9 3950X
Original Processor Frequency: 3500.0 MHz
Original Processor Frequency [MHz]: 3500
CPU Brand Name: AMD Ryzen 9 3950X 16-Core Processor
CPU Vendor: AuthenticAMD
CPU Stepping: MTS-B0
CPU Code Name: Matisse
CPU OPN: 100-000000051
CPU Type: Production Unit
CPU Platform: AM4
Microcode Update Revision: 8701021
[Operating Points]
[Cache and TLB]
[Standard Feature Flags]
[Extended Feature Flags]
[Enhanced Features]
[Memory Ranges]
[MTRRs]
Motherboard ---------------------------------------------------------------
[Computer]
[Motherboard]
Motherboard Model: ASUS Pro WS X570-ACE
Motherboard Chipset: AMD X570 (Bixby)
[BIOS]
BIOS Manufacturer: American Megatrends Inc.
BIOS Date: 05/26/2021
BIOS Version: 3601
UEFI BIOS: Capable
Super-IO/LPC Chip: Winbond/Nuvoton NCT6798D
Memory --------------------------------------------------------------------
[General information]
Total Memory Size: 64 GBytes
Total Memory Size [MB]: 65536
[Current Performance Settings]
Maximum Supported Memory Clock: Unlimited
Current Memory Clock: 1330.9 MHz
Current Timing (tCAS-tRCD-tRP-tRAS): 20-19-19-43
Memory Channels Supported: 2
Memory Channels Active: 2
Command Rate: 1T
Read to Read Delay (tRD_RD) Same Rank: 4T
Read to Read Delay (tRD_RD) Different DIMM: 4T
Write to Write Delay (tWR_WR) Same Rank: 4T
Write to Write Delay (tWR_WR) Different DIMM: 6T
Read to Precharge Delay (tRTP): 10T
Write to Precharge Delay (tWTP): 31T
Write Recovery Time (tWR): 20T
Row Cycle Time (tRC): 62T
Refresh Cycle Time (tRFC): 734T
Four Activate Window (tFAW): 28T
Row: 2 [BANK 1/DIMM_A2] - 32 GB PC4-21300 DDR4 SDRAM G Skill F4-3600C18-32GVK
[General Module Information]
Module Number: 2
Module Size: 32 GBytes
Memory Type: DDR4 SDRAM
Module Type: Unbuffered DIMM (UDIMM)
Memory Speed: 1333.3 MHz (DDR4-2666 / PC4-21300)
Module Manufacturer: G Skill
Module Part Number: F4-3600C18-32GVK
Module Revision: 0.0
Module Serial Number: N/A
Module Manufacturing Date: N/A
Module Manufacturing Location: 0
SDRAM Manufacturer: SK Hynix
DRAM Steppping: 0.0
Error Check/Correction: None
[Module Characteristics]
Row Address Bits: 17
Column Address Bits: 10
Module Density: 16384 Mb
Number Of Ranks: 2
Device Width: 8 bits
Bus Width: 64 bits
Die Count: 1
Module Nominal Voltage (VDD): 1.2 V
Minimum SDRAM Cycle Time (tCKAVGmin): 0.75000 ns
Maximum SDRAM Cycle Time (tCKAVGmax): 1.60000 ns
CAS# Latencies Supported: 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20
Minimum CAS# Latency Time (tAAmin): 13.750 ns
Minimum RAS# to CAS# Delay (tRCDmin): 13.750 ns
Minimum Row Precharge Time (tRPmin): 13.750 ns
Minimum Active to Precharge Time (tRASmin): 32.000 ns
Supported Module Timing at 1333.3 MHz: 19-19-19-43
Supported Module Timing at 1200.0 MHz: 17-17-17-39
Supported Module Timing at 1066.7 MHz: 15-15-15-35
Supported Module Timing at 933.3 MHz: 13-13-13-30
Supported Module Timing at 800.0 MHz: 11-11-11-26
Supported Module Timing at 666.7 MHz: 10-10-10-22
Minimum Active to Active/Refresh Time (tRCmin): 45.750 ns
Minimum Refresh Recovery Time Delay (tRFC1min): 550.000 ns
Minimum Refresh Recovery Time Delay (tRFC2min): 350.000 ns
Minimum Refresh Recovery Time Delay (tRFC4min): 260.000 ns
Minimum Four Activate Window Delay Time (tFAWmin): 21.000 ns
Minimum Active to Active Delay Time - Different Bank Group (tRRD_Smin): 3.000 ns
Minimum Active to Active Delay Time - Same Bank Group (tRRD_Lmin): 4.900 ns
Minimum CAS to CAS Delay Time - Same Bank Group (tCCD_Lmin): 5.000 ns
[Features]
Module Temperature Sensor (TSOD): Not Supported
Module Nominal Height: 31 - 32 mm
Module Maximum Thickness (Front): 1 - 2 mm
Module Maximum Thickness (Back): 1 - 2 mm
Address Mapping from Edge Connector to DRAM: Mirrored
[Intel Extreme Memory Profile (XMP)]
XMP Revision: 2.0
[Certified Profile [Enabled]]
Module VDD Voltage Level: 1.35 V
Minimum SDRAM Cycle Time (tCKAVGmin): 0.55500 ns
CAS# Latencies Supported: 18
Minimum CAS# Latency Time (tAAmin): 9.759 ns
Minimum RAS# to CAS# Delay (tRCDmin): 12.039 ns
Minimum Row Precharge Time (tRPmin): 12.039 ns
Minimum Active to Precharge Time (tRASmin): 23.250 ns
Supported Module Timing at 1800.0 MHz: 18-22-22-42
Minimum Active to Active/Refresh Time (tRCmin): 35.500 ns
Minimum Refresh Recovery Time Delay (tRFC1min): 550.000 ns
Minimum Refresh Recovery Time Delay (tRFC2min): 350.000 ns
Minimum Refresh Recovery Time Delay (tRFC4min): 260.000 ns
Minimum Four Activate Window Delay Time (tFAWmin): 24.000 ns
Minimum Active to Active Delay Time - Different Bank Group (tRRD_Smin): 2.029 ns
Minimum Active to Active Delay Time - Same Bank Group (tRRD_Lmin): 4.849 ns
Row: 3 [BANK 3/DIMM_B2] - 32 GB PC4-21300 DDR4 SDRAM G Skill F4-3600C18-32GVK
[General Module Information]
Module Number: 3
Module Size: 32 GBytes
Memory Type: DDR4 SDRAM
Module Type: Unbuffered DIMM (UDIMM)
Memory Speed: 1333.3 MHz (DDR4-2666 / PC4-21300)
Module Manufacturer: G Skill
Module Part Number: F4-3600C18-32GVK
Module Revision: 0.0
Module Serial Number: N/A
Module Manufacturing Date: N/A
Module Manufacturing Location: 0
SDRAM Manufacturer: SK Hynix
DRAM Steppping: 0.0
Error Check/Correction: None
[Module Characteristics]
Row Address Bits: 17
Column Address Bits: 10
Module Density: 16384 Mb
Number Of Ranks: 2
Device Width: 8 bits
Bus Width: 64 bits
Die Count: 1
Module Nominal Voltage (VDD): 1.2 V
Minimum SDRAM Cycle Time (tCKAVGmin): 0.75000 ns
Maximum SDRAM Cycle Time (tCKAVGmax): 1.60000 ns
CAS# Latencies Supported: 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20
Minimum CAS# Latency Time (tAAmin): 13.750 ns
Minimum RAS# to CAS# Delay (tRCDmin): 13.750 ns
Minimum Row Precharge Time (tRPmin): 13.750 ns
Minimum Active to Precharge Time (tRASmin): 32.000 ns
Supported Module Timing at 1333.3 MHz: 19-19-19-43
Supported Module Timing at 1200.0 MHz: 17-17-17-39
Supported Module Timing at 1066.7 MHz: 15-15-15-35
Supported Module Timing at 933.3 MHz: 13-13-13-30
Supported Module Timing at 800.0 MHz: 11-11-11-26
Supported Module Timing at 666.7 MHz: 10-10-10-22
Minimum Active to Active/Refresh Time (tRCmin): 45.750 ns
Minimum Refresh Recovery Time Delay (tRFC1min): 550.000 ns
Minimum Refresh Recovery Time Delay (tRFC2min): 350.000 ns
Minimum Refresh Recovery Time Delay (tRFC4min): 260.000 ns
Minimum Four Activate Window Delay Time (tFAWmin): 21.000 ns
Minimum Active to Active Delay Time - Different Bank Group (tRRD_Smin): 3.000 ns
Minimum Active to Active Delay Time - Same Bank Group (tRRD_Lmin): 4.900 ns
Minimum CAS to CAS Delay Time - Same Bank Group (tCCD_Lmin): 5.000 ns
[Features]
Module Temperature Sensor (TSOD): Not Supported
Module Nominal Height: 31 - 32 mm
Module Maximum Thickness (Front): 1 - 2 mm
Module Maximum Thickness (Back): 1 - 2 mm
Address Mapping from Edge Connector to DRAM: Mirrored
[Intel Extreme Memory Profile (XMP)]
XMP Revision: 2.0
[Certified Profile [Enabled]]
Module VDD Voltage Level: 1.35 V
Minimum SDRAM Cycle Time (tCKAVGmin): 0.55500 ns
CAS# Latencies Supported: 18
Minimum CAS# Latency Time (tAAmin): 9.759 ns
Minimum RAS# to CAS# Delay (tRCDmin): 12.039 ns
Minimum Row Precharge Time (tRPmin): 12.039 ns
Minimum Active to Precharge Time (tRASmin): 23.250 ns
Supported Module Timing at 1800.0 MHz: 18-22-22-42
Minimum Active to Active/Refresh Time (tRCmin): 35.500 ns
Minimum Refresh Recovery Time Delay (tRFC1min): 550.000 ns
Minimum Refresh Recovery Time Delay (tRFC2min): 350.000 ns
Minimum Refresh Recovery Time Delay (tRFC4min): 260.000 ns
Minimum Four Activate Window Delay Time (tFAWmin): 24.000 ns
Minimum Active to Active Delay Time - Different Bank Group (tRRD_Smin): 2.029 ns
Minimum Active to Active Delay Time - Same Bank Group (tRRD_Lmin): 4.849 ns
Video Adapter -------------------------------------------------------------
NVIDIA GeForce RTX 2080 ---------------------------------------------------
[Video chipset]
Video Chipset: NVIDIA GeForce RTX 2080
Video Chipset Codename: TU104-400A
Video Memory: 8192 MBytes of GDDR6 SDRAM [Samsung]
[Video Card]
Video Card: ASUS ROG STRIX RTX 2080 GAMING OC 8G
Video Bus: PCIe v3.0 x16 (8.0 GT/s) @ x16 (8.0 GT/s)
Video RAMDAC: Integrated RAMDAC
Video BIOS Version: 90.04.0b.40.52
Video Chipset Revision: A1
[Performance]
Graphics Processor Clock: 1515.0 MHz
Video Unit Clock: 1395.0 MHz
Graphics Memory Clock: 1750.0 MHz (Effective 14000.0 MHz)
Graphics Memory Bus Width: 256-bit
Number Of ROPs: 64
Number Of Unified Shaders: 2944
Number Of Ray Tracing Cores: 46
Number Of Tensor Cores: 368
Number Of TMUs (Texture Mapping Units): 184
ASIC Serial Number: 352237786513
NVIDIA SLI Status: Not Present
Resizable BAR Support: Supported
Resizable BAR State: Disabled (256 MB)
Hardware ID: PCI\VEN_10DE&DEV_1E87&SUBSYS_865F1043&REV_A1
PCI Location (Bus:Dev:Fnc): 14:00:0
[Driver Information]HWiNFO64 Version 7.02-4430
MONSTER -------------------------------------------------------------------
[Current Computer]
[Operating System]
Operating System: Microsoft Windows 10 Professional (x64) Build 19043.1110
UEFI Boot: Present
Secure Boot: Present
Central Processor(s) ------------------------------------------------------
[CPU Unit Count]
Number Of Processor Packages (Physical): 1
Number Of Processor Cores: 16
Number Of Logical Processors: 32
AMD Ryzen 9 3950X ---------------------------------------------------------
[General Information]
Processor Name: AMD Ryzen 9 3950X
Original Processor Frequency: 3500.0 MHz
Original Processor Frequency [MHz]: 3500
CPU Brand Name: AMD Ryzen 9 3950X 16-Core Processor
CPU Vendor: AuthenticAMD
CPU Stepping: MTS-B0
CPU Code Name: Matisse
CPU OPN: 100-000000051
CPU Type: Production Unit
CPU Platform: AM4
Microcode Update Revision: 8701021
[Operating Points]
[Cache and TLB]
[Standard Feature Flags]
[Extended Feature Flags]
[Enhanced Features]
[Memory Ranges]
[MTRRs]
Motherboard ---------------------------------------------------------------
[Computer]
[Motherboard]
Motherboard Model: ASUS Pro WS X570-ACE
Motherboard Chipset: AMD X570 (Bixby)
[BIOS]
BIOS Manufacturer: American Megatrends Inc.
BIOS Date: 05/26/2021
BIOS Version: 3601
UEFI BIOS: Capable
Super-IO/LPC Chip: Winbond/Nuvoton NCT6798D
Memory --------------------------------------------------------------------
[General information]
Total Memory Size: 64 GBytes
Total Memory Size [MB]: 65536
[Current Performance Settings]
Maximum Supported Memory Clock: Unlimited
Current Memory Clock: 1330.9 MHz
Current Timing (tCAS-tRCD-tRP-tRAS): 20-19-19-43
Memory Channels Supported: 2
Memory Channels Active: 2
Command Rate: 1T
Read to Read Delay (tRD_RD) Same Rank: 4T
Read to Read Delay (tRD_RD) Different DIMM: 4T
Write to Write Delay (tWR_WR) Same Rank: 4T
Write to Write Delay (tWR_WR) Different DIMM: 6T
Read to Precharge Delay (tRTP): 10T
Write to Precharge Delay (tWTP): 31T
Write Recovery Time (tWR): 20T
Row Cycle Time (tRC): 62T
Refresh Cycle Time (tRFC): 734T
Four Activate Window (tFAW): 28T
Row: 2 [BANK 1/DIMM_A2] - 32 GB PC4-21300 DDR4 SDRAM G Skill F4-3600C18-32GVK
[General Module Information]
Module Number: 2
Module Size: 32 GBytes
Memory Type: DDR4 SDRAM
Module Type: Unbuffered DIMM (UDIMM)
Memory Speed: 1333.3 MHz (DDR4-2666 / PC4-21300)
Module Manufacturer: G Skill
Module Part Number: F4-3600C18-32GVK
Module Revision: 0.0
Module Serial Number: N/A
Module Manufacturing Date: N/A
Module Manufacturing Location: 0
SDRAM Manufacturer: SK Hynix
DRAM Steppping: 0.0
Error Check/Correction: None
[Module Characteristics]
Row Address Bits: 17
Column Address Bits: 10
Module Density: 16384 Mb
Number Of Ranks: 2
Device Width: 8 bits
Bus Width: 64 bits
Die Count: 1
Module Nominal Voltage (VDD): 1.2 V
Minimum SDRAM Cycle Time (tCKAVGmin): 0.75000 ns
Maximum SDRAM Cycle Time (tCKAVGmax): 1.60000 ns
CAS# Latencies Supported: 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20
Minimum CAS# Latency Time (tAAmin): 13.750 ns
Minimum RAS# to CAS# Delay (tRCDmin): 13.750 ns
Minimum Row Precharge Time (tRPmin): 13.750 ns
Minimum Active to Precharge Time (tRASmin): 32.000 ns
Supported Module Timing at 1333.3 MHz: 19-19-19-43
Supported Module Timing at 1200.0 MHz: 17-17-17-39
Supported Module Timing at 1066.7 MHz: 15-15-15-35
Supported Module Timing at 933.3 MHz: 13-13-13-30
Supported Module Timing at 800.0 MHz: 11-11-11-26
Supported Module Timing at 666.7 MHz: 10-10-10-22
Minimum Active to Active/Refresh Time (tRCmin): 45.750 ns
Minimum Refresh Recovery Time Delay (tRFC1min): 550.000 ns
Minimum Refresh Recovery Time Delay (tRFC2min): 350.000 ns
Minimum Refresh Recovery Time Delay (tRFC4min): 260.000 ns
Minimum Four Activate Window Delay Time (tFAWmin): 21.000 ns
Minimum Active to Active Delay Time - Different Bank Group (tRRD_Smin): 3.000 ns
Minimum Active to Active Delay Time - Same Bank Group (tRRD_Lmin): 4.900 ns
Minimum CAS to CAS Delay Time - Same Bank Group (tCCD_Lmin): 5.000 ns
[Features]
Module Temperature Sensor (TSOD): Not Supported
Module Nominal Height: 31 - 32 mm
Module Maximum Thickness (Front): 1 - 2 mm
Module Maximum Thickness (Back): 1 - 2 mm
Address Mapping from Edge Connector to DRAM: Mirrored
[Intel Extreme Memory Profile (XMP)]
XMP Revision: 2.0
[Certified Profile [Enabled]]
Module VDD Voltage Level: 1.35 V
Minimum SDRAM Cycle Time (tCKAVGmin): 0.55500 ns
CAS# Latencies Supported: 18
Minimum CAS# Latency Time (tAAmin): 9.759 ns
Minimum RAS# to CAS# Delay (tRCDmin): 12.039 ns
Minimum Row Precharge Time (tRPmin): 12.039 ns
Minimum Active to Precharge Time (tRASmin): 23.250 ns
Supported Module Timing at 1800.0 MHz: 18-22-22-42
Minimum Active to Active/Refresh Time (tRCmin): 35.500 ns
Minimum Refresh Recovery Time Delay (tRFC1min): 550.000 ns
Minimum Refresh Recovery Time Delay (tRFC2min): 350.000 ns
Minimum Refresh Recovery Time Delay (tRFC4min): 260.000 ns
Minimum Four Activate Window Delay Time (tFAWmin): 24.000 ns
Minimum Active to Active Delay Time - Different Bank Group (tRRD_Smin): 2.029 ns
Minimum Active to Active Delay Time - Same Bank Group (tRRD_Lmin): 4.849 ns
Row: 3 [BANK 3/DIMM_B2] - 32 GB PC4-21300 DDR4 SDRAM G Skill F4-3600C18-32GVK
[General Module Information]
Module Number: 3
Module Size: 32 GBytes
Memory Type: DDR4 SDRAM
Module Type: Unbuffered DIMM (UDIMM)
Memory Speed: 1333.3 MHz (DDR4-2666 / PC4-21300)
Module Manufacturer: G Skill
Module Part Number: F4-3600C18-32GVK
Module Revision: 0.0
Module Serial Number: N/A
Module Manufacturing Date: N/A
Module Manufacturing Location: 0
SDRAM Manufacturer: SK Hynix
DRAM Steppping: 0.0
Error Check/Correction: None
[Module Characteristics]
Row Address Bits: 17
Column Address Bits: 10
Module Density: 16384 Mb
Number Of Ranks: 2
Device Width: 8 bits
Bus Width: 64 bits
Die Count: 1
Module Nominal Voltage (VDD): 1.2 V
Minimum SDRAM Cycle Time (tCKAVGmin): 0.75000 ns
Maximum SDRAM Cycle Time (tCKAVGmax): 1.60000 ns
CAS# Latencies Supported: 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20
Minimum CAS# Latency Time (tAAmin): 13.750 ns
Minimum RAS# to CAS# Delay (tRCDmin): 13.750 ns
Minimum Row Precharge Time (tRPmin): 13.750 ns
Minimum Active to Precharge Time (tRASmin): 32.000 ns
Supported Module Timing at 1333.3 MHz: 19-19-19-43
Supported Module Timing at 1200.0 MHz: 17-17-17-39
Supported Module Timing at 1066.7 MHz: 15-15-15-35
Supported Module Timing at 933.3 MHz: 13-13-13-30
Supported Module Timing at 800.0 MHz: 11-11-11-26
Supported Module Timing at 666.7 MHz: 10-10-10-22
Minimum Active to Active/Refresh Time (tRCmin): 45.750 ns
Minimum Refresh Recovery Time Delay (tRFC1min): 550.000 ns
Minimum Refresh Recovery Time Delay (tRFC2min): 350.000 ns
Minimum Refresh Recovery Time Delay (tRFC4min): 260.000 ns
Minimum Four Activate Window Delay Time (tFAWmin): 21.000 ns
Minimum Active to Active Delay Time - Different Bank Group (tRRD_Smin): 3.000 ns
Minimum Active to Active Delay Time - Same Bank Group (tRRD_Lmin): 4.900 ns
Minimum CAS to CAS Delay Time - Same Bank Group (tCCD_Lmin): 5.000 ns
[Features]
Module Temperature Sensor (TSOD): Not Supported
Module Nominal Height: 31 - 32 mm
Module Maximum Thickness (Front): 1 - 2 mm
Module Maximum Thickness (Back): 1 - 2 mm
Address Mapping from Edge Connector to DRAM: Mirrored
[Intel Extreme Memory Profile (XMP)]
XMP Revision: 2.0
[Certified Profile [Enabled]]
Module VDD Voltage Level: 1.35 V
Minimum SDRAM Cycle Time (tCKAVGmin): 0.55500 ns
CAS# Latencies Supported: 18
Minimum CAS# Latency Time (tAAmin): 9.759 ns
Minimum RAS# to CAS# Delay (tRCDmin): 12.039 ns
Minimum Row Precharge Time (tRPmin): 12.039 ns
Minimum Active to Precharge Time (tRASmin): 23.250 ns
Supported Module Timing at 1800.0 MHz: 18-22-22-42
Minimum Active to Active/Refresh Time (tRCmin): 35.500 ns
Minimum Refresh Recovery Time Delay (tRFC1min): 550.000 ns
Minimum Refresh Recovery Time Delay (tRFC2min): 350.000 ns
Minimum Refresh Recovery Time Delay (tRFC4min): 260.000 ns
Minimum Four Activate Window Delay Time (tFAWmin): 24.000 ns
Minimum Active to Active Delay Time - Different Bank Group (tRRD_Smin): 2.029 ns
Minimum Active to Active Delay Time - Same Bank Group (tRRD_Lmin): 4.849 ns
Video Adapter -------------------------------------------------------------
NVIDIA GeForce RTX 2080 ---------------------------------------------------
[Video chipset]
Video Chipset: NVIDIA GeForce RTX 2080
Video Chipset Codename: TU104-400A
Video Memory: 8192 MBytes of GDDR6 SDRAM [Samsung]
[Video Card]
Video Card: ASUS ROG STRIX RTX 2080 GAMING OC 8G
Video Bus: PCIe v3.0 x16 (8.0 GT/s) @ x16 (8.0 GT/s)
Video RAMDAC: Integrated RAMDAC
Video BIOS Version: 90.04.0b.40.52
Video Chipset Revision: A1
[Performance]
Graphics Processor Clock: 1515.0 MHz
Video Unit Clock: 1395.0 MHz
Graphics Memory Clock: 1750.0 MHz (Effective 14000.0 MHz)
Graphics Memory Bus Width: 256-bit
Number Of ROPs: 64
Number Of Unified Shaders: 2944
Number Of Ray Tracing Cores: 46
Number Of Tensor Cores: 368
Number Of TMUs (Texture Mapping Units): 184
ASIC Serial Number: 352237786513
NVIDIA SLI Status: Not Present
Resizable BAR Support: Supported
Resizable BAR State: Disabled (256 MB)
Hardware ID: PCI\VEN_10DE&DEV_1E87&SUBSYS_865F1043&REV_A1
PCI Location (Bus:Dev:Fnc): 14:00:0
[Driver Information]
Driver Manufacturer: NVIDIA
Driver Description: NVIDIA GeForce RTX 2080
Driver Provider: NVIDIA
Driver Version: 30.0.14.7111 (GeForce 471.11)
Driver Date: 20-Jun-2021
DCH/UWD Driver: Capable
DeviceInstanceId PCI\VEN_10DE&DEV_1E87&SUBSYS_865F1043&REV_A1\4&2AE1B128&0&0019
Location Paths PCIROOT(0)#PCI(0301)#PCI(0000)
Driver Manufacturer: NVIDIA
Driver Description: NVIDIA GeForce RTX 2080
Driver Provider: NVIDIA
Driver Version: 30.0.14.7111 (GeForce 471.11)
Driver Date: 20-Jun-2021
DCH/UWD Driver: Capable
DeviceInstanceId PCI\VEN_10DE&DEV_1E87&SUBSYS_865F1043&REV_A1\4&2AE1B128&0&0019
Location Paths PCIROOT(0)#PCI(0301)#PCI(0000)
Nvidia
It appears the VU meters in Fairlight are temperamental in that changing the processing order sometimes results in no level display.
I have changed my order from the default (F-E-D) to (F-D-E) and noticed that no levels were being displayed. Upon checking the other order options, some others also did not display the levels however the one I initially chose started to show the track level again.
There seems to be no rhyme or reason why it sometimes does or does not display a track level.
***************DIAGNOTIC INFO*******************************
HWiNFO64 Version 7.02-4430
MONSTER -------------------------------------------------------------------
[Current Computer]
[Operating System]
Operating System: Microsoft Windows 10 Professional (x64) Build 19043.1110
UEFI Boot: Present
Secure Boot: Present
Central Processor(s) ------------------------------------------------------
[CPU Unit Count]
Number Of Processor Packages (Physical): 1
Number Of Processor Cores: 16
Number Of Logical Processors: 32
AMD Ryzen 9 3950X ---------------------------------------------------------
[General Information]
Processor Name: AMD Ryzen 9 3950X
Original Processor Frequency: 3500.0 MHz
Original Processor Frequency [MHz]: 3500
CPU Brand Name: AMD Ryzen 9 3950X 16-Core Processor
CPU Vendor: AuthenticAMD
CPU Stepping: MTS-B0
CPU Code Name: Matisse
CPU OPN: 100-000000051
CPU Type: Production Unit
CPU Platform: AM4
Microcode Update Revision: 8701021
[Operating Points]
[Cache and TLB]
[Standard Feature Flags]
[Extended Feature Flags]
[Enhanced Features]
[Memory Ranges]
[MTRRs]
Motherboard ---------------------------------------------------------------
[Computer]
[Motherboard]
Motherboard Model: ASUS Pro WS X570-ACE
Motherboard Chipset: AMD X570 (Bixby)
[BIOS]
BIOS Manufacturer: American Megatrends Inc.
BIOS Date: 05/26/2021
BIOS Version: 3601
UEFI BIOS: Capable
Super-IO/LPC Chip: Winbond/Nuvoton NCT6798D
Memory --------------------------------------------------------------------
[General information]
Total Memory Size: 64 GBytes
Total Memory Size [MB]: 65536
[Current Performance Settings]
Maximum Supported Memory Clock: Unlimited
Current Memory Clock: 1330.9 MHz
Current Timing (tCAS-tRCD-tRP-tRAS): 20-19-19-43
Memory Channels Supported: 2
Memory Channels Active: 2
Command Rate: 1T
Read to Read Delay (tRD_RD) Same Rank: 4T
Read to Read Delay (tRD_RD) Different DIMM: 4T
Write to Write Delay (tWR_WR) Same Rank: 4T
Write to Write Delay (tWR_WR) Different DIMM: 6T
Read to Precharge Delay (tRTP): 10T
Write to Precharge Delay (tWTP): 31T
Write Recovery Time (tWR): 20T
Row Cycle Time (tRC): 62T
Refresh Cycle Time (tRFC): 734T
Four Activate Window (tFAW): 28T
Row: 2 [BANK 1/DIMM_A2] - 32 GB PC4-21300 DDR4 SDRAM G Skill F4-3600C18-32GVK
[General Module Information]
Module Number: 2
Module Size: 32 GBytes
Memory Type: DDR4 SDRAM
Module Type: Unbuffered DIMM (UDIMM)
Memory Speed: 1333.3 MHz (DDR4-2666 / PC4-21300)
Module Manufacturer: G Skill
Module Part Number: F4-3600C18-32GVK
Module Revision: 0.0
Module Serial Number: N/A
Module Manufacturing Date: N/A
Module Manufacturing Location: 0
SDRAM Manufacturer: SK Hynix
DRAM Steppping: 0.0
Error Check/Correction: None
[Module Characteristics]
Row Address Bits: 17
Column Address Bits: 10
Module Density: 16384 Mb
Number Of Ranks: 2
Device Width: 8 bits
Bus Width: 64 bits
Die Count: 1
Module Nominal Voltage (VDD): 1.2 V
Minimum SDRAM Cycle Time (tCKAVGmin): 0.75000 ns
Maximum SDRAM Cycle Time (tCKAVGmax): 1.60000 ns
CAS# Latencies Supported: 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20
Minimum CAS# Latency Time (tAAmin): 13.750 ns
Minimum RAS# to CAS# Delay (tRCDmin): 13.750 ns
Minimum Row Precharge Time (tRPmin): 13.750 ns
Minimum Active to Precharge Time (tRASmin): 32.000 ns
Supported Module Timing at 1333.3 MHz: 19-19-19-43
Supported Module Timing at 1200.0 MHz: 17-17-17-39
Supported Module Timing at 1066.7 MHz: 15-15-15-35
Supported Module Timing at 933.3 MHz: 13-13-13-30
Supported Module Timing at 800.0 MHz: 11-11-11-26
Supported Module Timing at 666.7 MHz: 10-10-10-22
Minimum Active to Active/Refresh Time (tRCmin): 45.750 ns
Minimum Refresh Recovery Time Delay (tRFC1min): 550.000 ns
Minimum Refresh Recovery Time Delay (tRFC2min): 350.000 ns
Minimum Refresh Recovery Time Delay (tRFC4min): 260.000 ns
Minimum Four Activate Window Delay Time (tFAWmin): 21.000 ns
Minimum Active to Active Delay Time - Different Bank Group (tRRD_Smin): 3.000 ns
Minimum Active to Active Delay Time - Same Bank Group (tRRD_Lmin): 4.900 ns
Minimum CAS to CAS Delay Time - Same Bank Group (tCCD_Lmin): 5.000 ns
[Features]
Module Temperature Sensor (TSOD): Not Supported
Module Nominal Height: 31 - 32 mm
Module Maximum Thickness (Front): 1 - 2 mm
Module Maximum Thickness (Back): 1 - 2 mm
Address Mapping from Edge Connector to DRAM: Mirrored
[Intel Extreme Memory Profile (XMP)]
XMP Revision: 2.0
[Certified Profile [Enabled]]
Module VDD Voltage Level: 1.35 V
Minimum SDRAM Cycle Time (tCKAVGmin): 0.55500 ns
CAS# Latencies Supported: 18
Minimum CAS# Latency Time (tAAmin): 9.759 ns
Minimum RAS# to CAS# Delay (tRCDmin): 12.039 ns
Minimum Row Precharge Time (tRPmin): 12.039 ns
Minimum Active to Precharge Time (tRASmin): 23.250 ns
Supported Module Timing at 1800.0 MHz: 18-22-22-42
Minimum Active to Active/Refresh Time (tRCmin): 35.500 ns
Minimum Refresh Recovery Time Delay (tRFC1min): 550.000 ns
Minimum Refresh Recovery Time Delay (tRFC2min): 350.000 ns
Minimum Refresh Recovery Time Delay (tRFC4min): 260.000 ns
Minimum Four Activate Window Delay Time (tFAWmin): 24.000 ns
Minimum Active to Active Delay Time - Different Bank Group (tRRD_Smin): 2.029 ns
Minimum Active to Active Delay Time - Same Bank Group (tRRD_Lmin): 4.849 ns
Row: 3 [BANK 3/DIMM_B2] - 32 GB PC4-21300 DDR4 SDRAM G Skill F4-3600C18-32GVK
[General Module Information]
Module Number: 3
Module Size: 32 GBytes
Memory Type: DDR4 SDRAM
Module Type: Unbuffered DIMM (UDIMM)
Memory Speed: 1333.3 MHz (DDR4-2666 / PC4-21300)
Module Manufacturer: G Skill
Module Part Number: F4-3600C18-32GVK
Module Revision: 0.0
Module Serial Number: N/A
Module Manufacturing Date: N/A
Module Manufacturing Location: 0
SDRAM Manufacturer: SK Hynix
DRAM Steppping: 0.0
Error Check/Correction: None
[Module Characteristics]
Row Address Bits: 17
Column Address Bits: 10
Module Density: 16384 Mb
Number Of Ranks: 2
Device Width: 8 bits
Bus Width: 64 bits
Die Count: 1
Module Nominal Voltage (VDD): 1.2 V
Minimum SDRAM Cycle Time (tCKAVGmin): 0.75000 ns
Maximum SDRAM Cycle Time (tCKAVGmax): 1.60000 ns
CAS# Latencies Supported: 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20
Minimum CAS# Latency Time (tAAmin): 13.750 ns
Minimum RAS# to CAS# Delay (tRCDmin): 13.750 ns
Minimum Row Precharge Time (tRPmin): 13.750 ns
Minimum Active to Precharge Time (tRASmin): 32.000 ns
Supported Module Timing at 1333.3 MHz: 19-19-19-43
Supported Module Timing at 1200.0 MHz: 17-17-17-39
Supported Module Timing at 1066.7 MHz: 15-15-15-35
Supported Module Timing at 933.3 MHz: 13-13-13-30
Supported Module Timing at 800.0 MHz: 11-11-11-26
Supported Module Timing at 666.7 MHz: 10-10-10-22
Minimum Active to Active/Refresh Time (tRCmin): 45.750 ns
Minimum Refresh Recovery Time Delay (tRFC1min): 550.000 ns
Minimum Refresh Recovery Time Delay (tRFC2min): 350.000 ns
Minimum Refresh Recovery Time Delay (tRFC4min): 260.000 ns
Minimum Four Activate Window Delay Time (tFAWmin): 21.000 ns
Minimum Active to Active Delay Time - Different Bank Group (tRRD_Smin): 3.000 ns
Minimum Active to Active Delay Time - Same Bank Group (tRRD_Lmin): 4.900 ns
Minimum CAS to CAS Delay Time - Same Bank Group (tCCD_Lmin): 5.000 ns
[Features]
Module Temperature Sensor (TSOD): Not Supported
Module Nominal Height: 31 - 32 mm
Module Maximum Thickness (Front): 1 - 2 mm
Module Maximum Thickness (Back): 1 - 2 mm
Address Mapping from Edge Connector to DRAM: Mirrored
[Intel Extreme Memory Profile (XMP)]
XMP Revision: 2.0
[Certified Profile [Enabled]]
Module VDD Voltage Level: 1.35 V
Minimum SDRAM Cycle Time (tCKAVGmin): 0.55500 ns
CAS# Latencies Supported: 18
Minimum CAS# Latency Time (tAAmin): 9.759 ns
Minimum RAS# to CAS# Delay (tRCDmin): 12.039 ns
Minimum Row Precharge Time (tRPmin): 12.039 ns
Minimum Active to Precharge Time (tRASmin): 23.250 ns
Supported Module Timing at 1800.0 MHz: 18-22-22-42
Minimum Active to Active/Refresh Time (tRCmin): 35.500 ns
Minimum Refresh Recovery Time Delay (tRFC1min): 550.000 ns
Minimum Refresh Recovery Time Delay (tRFC2min): 350.000 ns
Minimum Refresh Recovery Time Delay (tRFC4min): 260.000 ns
Minimum Four Activate Window Delay Time (tFAWmin): 24.000 ns
Minimum Active to Active Delay Time - Different Bank Group (tRRD_Smin): 2.029 ns
Minimum Active to Active Delay Time - Same Bank Group (tRRD_Lmin): 4.849 ns
Video Adapter -------------------------------------------------------------
NVIDIA GeForce RTX 2080 ---------------------------------------------------
[Video chipset]
Video Chipset: NVIDIA GeForce RTX 2080
Video Chipset Codename: TU104-400A
Video Memory: 8192 MBytes of GDDR6 SDRAM [Samsung]
[Video Card]
Video Card: ASUS ROG STRIX RTX 2080 GAMING OC 8G
Video Bus: PCIe v3.0 x16 (8.0 GT/s) @ x16 (8.0 GT/s)
Video RAMDAC: Integrated RAMDAC
Video BIOS Version: 90.04.0b.40.52
Video Chipset Revision: A1
[Performance]
Graphics Processor Clock: 1515.0 MHz
Video Unit Clock: 1395.0 MHz
Graphics Memory Clock: 1750.0 MHz (Effective 14000.0 MHz)
Graphics Memory Bus Width: 256-bit
Number Of ROPs: 64
Number Of Unified Shaders: 2944
Number Of Ray Tracing Cores: 46
Number Of Tensor Cores: 368
Number Of TMUs (Texture Mapping Units): 184
ASIC Serial Number: 352237786513
NVIDIA SLI Status: Not Present
Resizable BAR Support: Supported
Resizable BAR State: Disabled (256 MB)
Hardware ID: PCI\VEN_10DE&DEV_1E87&SUBSYS_865F1043&REV_A1
PCI Location (Bus:Dev:Fnc): 14:00:0
[Driver Information]HWiNFO64 Version 7.02-4430
MONSTER -------------------------------------------------------------------
[Current Computer]
[Operating System]
Operating System: Microsoft Windows 10 Professional (x64) Build 19043.1110
UEFI Boot: Present
Secure Boot: Present
Central Processor(s) ------------------------------------------------------
[CPU Unit Count]
Number Of Processor Packages (Physical): 1
Number Of Processor Cores: 16
Number Of Logical Processors: 32
AMD Ryzen 9 3950X ---------------------------------------------------------
[General Information]
Processor Name: AMD Ryzen 9 3950X
Original Processor Frequency: 3500.0 MHz
Original Processor Frequency [MHz]: 3500
CPU Brand Name: AMD Ryzen 9 3950X 16-Core Processor
CPU Vendor: AuthenticAMD
CPU Stepping: MTS-B0
CPU Code Name: Matisse
CPU OPN: 100-000000051
CPU Type: Production Unit
CPU Platform: AM4
Microcode Update Revision: 8701021
[Operating Points]
[Cache and TLB]
[Standard Feature Flags]
[Extended Feature Flags]
[Enhanced Features]
[Memory Ranges]
[MTRRs]
Motherboard ---------------------------------------------------------------
[Computer]
[Motherboard]
Motherboard Model: ASUS Pro WS X570-ACE
Motherboard Chipset: AMD X570 (Bixby)
[BIOS]
BIOS Manufacturer: American Megatrends Inc.
BIOS Date: 05/26/2021
BIOS Version: 3601
UEFI BIOS: Capable
Super-IO/LPC Chip: Winbond/Nuvoton NCT6798D
Memory --------------------------------------------------------------------
[General information]
Total Memory Size: 64 GBytes
Total Memory Size [MB]: 65536
[Current Performance Settings]
Maximum Supported Memory Clock: Unlimited
Current Memory Clock: 1330.9 MHz
Current Timing (tCAS-tRCD-tRP-tRAS): 20-19-19-43
Memory Channels Supported: 2
Memory Channels Active: 2
Command Rate: 1T
Read to Read Delay (tRD_RD) Same Rank: 4T
Read to Read Delay (tRD_RD) Different DIMM: 4T
Write to Write Delay (tWR_WR) Same Rank: 4T
Write to Write Delay (tWR_WR) Different DIMM: 6T
Read to Precharge Delay (tRTP): 10T
Write to Precharge Delay (tWTP): 31T
Write Recovery Time (tWR): 20T
Row Cycle Time (tRC): 62T
Refresh Cycle Time (tRFC): 734T
Four Activate Window (tFAW): 28T
Row: 2 [BANK 1/DIMM_A2] - 32 GB PC4-21300 DDR4 SDRAM G Skill F4-3600C18-32GVK
[General Module Information]
Module Number: 2
Module Size: 32 GBytes
Memory Type: DDR4 SDRAM
Module Type: Unbuffered DIMM (UDIMM)
Memory Speed: 1333.3 MHz (DDR4-2666 / PC4-21300)
Module Manufacturer: G Skill
Module Part Number: F4-3600C18-32GVK
Module Revision: 0.0
Module Serial Number: N/A
Module Manufacturing Date: N/A
Module Manufacturing Location: 0
SDRAM Manufacturer: SK Hynix
DRAM Steppping: 0.0
Error Check/Correction: None
[Module Characteristics]
Row Address Bits: 17
Column Address Bits: 10
Module Density: 16384 Mb
Number Of Ranks: 2
Device Width: 8 bits
Bus Width: 64 bits
Die Count: 1
Module Nominal Voltage (VDD): 1.2 V
Minimum SDRAM Cycle Time (tCKAVGmin): 0.75000 ns
Maximum SDRAM Cycle Time (tCKAVGmax): 1.60000 ns
CAS# Latencies Supported: 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20
Minimum CAS# Latency Time (tAAmin): 13.750 ns
Minimum RAS# to CAS# Delay (tRCDmin): 13.750 ns
Minimum Row Precharge Time (tRPmin): 13.750 ns
Minimum Active to Precharge Time (tRASmin): 32.000 ns
Supported Module Timing at 1333.3 MHz: 19-19-19-43
Supported Module Timing at 1200.0 MHz: 17-17-17-39
Supported Module Timing at 1066.7 MHz: 15-15-15-35
Supported Module Timing at 933.3 MHz: 13-13-13-30
Supported Module Timing at 800.0 MHz: 11-11-11-26
Supported Module Timing at 666.7 MHz: 10-10-10-22
Minimum Active to Active/Refresh Time (tRCmin): 45.750 ns
Minimum Refresh Recovery Time Delay (tRFC1min): 550.000 ns
Minimum Refresh Recovery Time Delay (tRFC2min): 350.000 ns
Minimum Refresh Recovery Time Delay (tRFC4min): 260.000 ns
Minimum Four Activate Window Delay Time (tFAWmin): 21.000 ns
Minimum Active to Active Delay Time - Different Bank Group (tRRD_Smin): 3.000 ns
Minimum Active to Active Delay Time - Same Bank Group (tRRD_Lmin): 4.900 ns
Minimum CAS to CAS Delay Time - Same Bank Group (tCCD_Lmin): 5.000 ns
[Features]
Module Temperature Sensor (TSOD): Not Supported
Module Nominal Height: 31 - 32 mm
Module Maximum Thickness (Front): 1 - 2 mm
Module Maximum Thickness (Back): 1 - 2 mm
Address Mapping from Edge Connector to DRAM: Mirrored
[Intel Extreme Memory Profile (XMP)]
XMP Revision: 2.0
[Certified Profile [Enabled]]
Module VDD Voltage Level: 1.35 V
Minimum SDRAM Cycle Time (tCKAVGmin): 0.55500 ns
CAS# Latencies Supported: 18
Minimum CAS# Latency Time (tAAmin): 9.759 ns
Minimum RAS# to CAS# Delay (tRCDmin): 12.039 ns
Minimum Row Precharge Time (tRPmin): 12.039 ns
Minimum Active to Precharge Time (tRASmin): 23.250 ns
Supported Module Timing at 1800.0 MHz: 18-22-22-42
Minimum Active to Active/Refresh Time (tRCmin): 35.500 ns
Minimum Refresh Recovery Time Delay (tRFC1min): 550.000 ns
Minimum Refresh Recovery Time Delay (tRFC2min): 350.000 ns
Minimum Refresh Recovery Time Delay (tRFC4min): 260.000 ns
Minimum Four Activate Window Delay Time (tFAWmin): 24.000 ns
Minimum Active to Active Delay Time - Different Bank Group (tRRD_Smin): 2.029 ns
Minimum Active to Active Delay Time - Same Bank Group (tRRD_Lmin): 4.849 ns
Row: 3 [BANK 3/DIMM_B2] - 32 GB PC4-21300 DDR4 SDRAM G Skill F4-3600C18-32GVK
[General Module Information]
Module Number: 3
Module Size: 32 GBytes
Memory Type: DDR4 SDRAM
Module Type: Unbuffered DIMM (UDIMM)
Memory Speed: 1333.3 MHz (DDR4-2666 / PC4-21300)
Module Manufacturer: G Skill
Module Part Number: F4-3600C18-32GVK
Module Revision: 0.0
Module Serial Number: N/A
Module Manufacturing Date: N/A
Module Manufacturing Location: 0
SDRAM Manufacturer: SK Hynix
DRAM Steppping: 0.0
Error Check/Correction: None
[Module Characteristics]
Row Address Bits: 17
Column Address Bits: 10
Module Density: 16384 Mb
Number Of Ranks: 2
Device Width: 8 bits
Bus Width: 64 bits
Die Count: 1
Module Nominal Voltage (VDD): 1.2 V
Minimum SDRAM Cycle Time (tCKAVGmin): 0.75000 ns
Maximum SDRAM Cycle Time (tCKAVGmax): 1.60000 ns
CAS# Latencies Supported: 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20
Minimum CAS# Latency Time (tAAmin): 13.750 ns
Minimum RAS# to CAS# Delay (tRCDmin): 13.750 ns
Minimum Row Precharge Time (tRPmin): 13.750 ns
Minimum Active to Precharge Time (tRASmin): 32.000 ns
Supported Module Timing at 1333.3 MHz: 19-19-19-43
Supported Module Timing at 1200.0 MHz: 17-17-17-39
Supported Module Timing at 1066.7 MHz: 15-15-15-35
Supported Module Timing at 933.3 MHz: 13-13-13-30
Supported Module Timing at 800.0 MHz: 11-11-11-26
Supported Module Timing at 666.7 MHz: 10-10-10-22
Minimum Active to Active/Refresh Time (tRCmin): 45.750 ns
Minimum Refresh Recovery Time Delay (tRFC1min): 550.000 ns
Minimum Refresh Recovery Time Delay (tRFC2min): 350.000 ns
Minimum Refresh Recovery Time Delay (tRFC4min): 260.000 ns
Minimum Four Activate Window Delay Time (tFAWmin): 21.000 ns
Minimum Active to Active Delay Time - Different Bank Group (tRRD_Smin): 3.000 ns
Minimum Active to Active Delay Time - Same Bank Group (tRRD_Lmin): 4.900 ns
Minimum CAS to CAS Delay Time - Same Bank Group (tCCD_Lmin): 5.000 ns
[Features]
Module Temperature Sensor (TSOD): Not Supported
Module Nominal Height: 31 - 32 mm
Module Maximum Thickness (Front): 1 - 2 mm
Module Maximum Thickness (Back): 1 - 2 mm
Address Mapping from Edge Connector to DRAM: Mirrored
[Intel Extreme Memory Profile (XMP)]
XMP Revision: 2.0
[Certified Profile [Enabled]]
Module VDD Voltage Level: 1.35 V
Minimum SDRAM Cycle Time (tCKAVGmin): 0.55500 ns
CAS# Latencies Supported: 18
Minimum CAS# Latency Time (tAAmin): 9.759 ns
Minimum RAS# to CAS# Delay (tRCDmin): 12.039 ns
Minimum Row Precharge Time (tRPmin): 12.039 ns
Minimum Active to Precharge Time (tRASmin): 23.250 ns
Supported Module Timing at 1800.0 MHz: 18-22-22-42
Minimum Active to Active/Refresh Time (tRCmin): 35.500 ns
Minimum Refresh Recovery Time Delay (tRFC1min): 550.000 ns
Minimum Refresh Recovery Time Delay (tRFC2min): 350.000 ns
Minimum Refresh Recovery Time Delay (tRFC4min): 260.000 ns
Minimum Four Activate Window Delay Time (tFAWmin): 24.000 ns
Minimum Active to Active Delay Time - Different Bank Group (tRRD_Smin): 2.029 ns
Minimum Active to Active Delay Time - Same Bank Group (tRRD_Lmin): 4.849 ns
Video Adapter -------------------------------------------------------------
NVIDIA GeForce RTX 2080 ---------------------------------------------------
[Video chipset]
Video Chipset: NVIDIA GeForce RTX 2080
Video Chipset Codename: TU104-400A
Video Memory: 8192 MBytes of GDDR6 SDRAM [Samsung]
[Video Card]
Video Card: ASUS ROG STRIX RTX 2080 GAMING OC 8G
Video Bus: PCIe v3.0 x16 (8.0 GT/s) @ x16 (8.0 GT/s)
Video RAMDAC: Integrated RAMDAC
Video BIOS Version: 90.04.0b.40.52
Video Chipset Revision: A1
[Performance]
Graphics Processor Clock: 1515.0 MHz
Video Unit Clock: 1395.0 MHz
Graphics Memory Clock: 1750.0 MHz (Effective 14000.0 MHz)
Graphics Memory Bus Width: 256-bit
Number Of ROPs: 64
Number Of Unified Shaders: 2944
Number Of Ray Tracing Cores: 46
Number Of Tensor Cores: 368
Number Of TMUs (Texture Mapping Units): 184
ASIC Serial Number: 352237786513
NVIDIA SLI Status: Not Present
Resizable BAR Support: Supported
Resizable BAR State: Disabled (256 MB)
Hardware ID: PCI\VEN_10DE&DEV_1E87&SUBSYS_865F1043&REV_A1
PCI Location (Bus:Dev:Fnc): 14:00:0
[Driver Information]
Driver Manufacturer: NVIDIA
Driver Description: NVIDIA GeForce RTX 2080
Driver Provider: NVIDIA
Driver Version: 30.0.14.7111 (GeForce 471.11)
Driver Date: 20-Jun-2021
DCH/UWD Driver: Capable
DeviceInstanceId PCI\VEN_10DE&DEV_1E87&SUBSYS_865F1043&REV_A1\4&2AE1B128&0&0019
Location Paths PCIROOT(0)#PCI(0301)#PCI(0000)
Driver Manufacturer: NVIDIA
Driver Description: NVIDIA GeForce RTX 2080
Driver Provider: NVIDIA
Driver Version: 30.0.14.7111 (GeForce 471.11)
Driver Date: 20-Jun-2021
DCH/UWD Driver: Capable
DeviceInstanceId PCI\VEN_10DE&DEV_1E87&SUBSYS_865F1043&REV_A1\4&2AE1B128&0&0019
Location Paths PCIROOT(0)#PCI(0301)#PCI(0000)